JPH0211348U - - Google Patents
Info
- Publication number
- JPH0211348U JPH0211348U JP8891988U JP8891988U JPH0211348U JP H0211348 U JPH0211348 U JP H0211348U JP 8891988 U JP8891988 U JP 8891988U JP 8891988 U JP8891988 U JP 8891988U JP H0211348 U JPH0211348 U JP H0211348U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- package
- housing
- metallized
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8891988U JPH0211348U (en]) | 1988-07-04 | 1988-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8891988U JPH0211348U (en]) | 1988-07-04 | 1988-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211348U true JPH0211348U (en]) | 1990-01-24 |
Family
ID=31313477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8891988U Pending JPH0211348U (en]) | 1988-07-04 | 1988-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211348U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014457A (ja) * | 1983-07-06 | 1985-01-25 | Narumi China Corp | 半導体装置用セラミツクパツケ−ジ |
-
1988
- 1988-07-04 JP JP8891988U patent/JPH0211348U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014457A (ja) * | 1983-07-06 | 1985-01-25 | Narumi China Corp | 半導体装置用セラミツクパツケ−ジ |
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